LED Structure

ABSTRACT

A light emitting device, a wafer for making the same, and method for fabricating the same are disclosed. The device and wafer include a first layer of a first conductivity type, an active layer, and a layer of a second conductivity type. The active layer overlies the first layer, the active layer generating light. The second layer overlies the active layer, the second layer having a first surface in contact adjacent to the active layer and a second surface having a surface that includes features that scatter light striking the second surface. A layer of transparent electrically conducing material is adjacent to the second surface and covered by a first layer of a dielectric material that is transparent to the light generated by the active layer. A mirror layer that has a reflectivity greater than 90 percent is deposited on the first layer of dielectric material.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation under 35 U.S.C. 120 of co-pending applicationSerial No. 11/952,048 filed on Dec. 6, 2007.

BACKGROUND OF THE INVENTION

Light emitting diodes (LEDs) are an important class of solid-statedevices that convert electric energy to light. Improvements in thesedevices have resulted in their use in light fixtures designed to replaceconventional incandescent and fluorescent light sources. The LEDs havesignificantly longer lifetimes and, in some cases, significantly higherefficiency for converting electric energy to light.

The cost and conversion efficiency of LEDs are important factors indetermining the rate at which this new technology will replaceconventional light sources and be utilized in high power applications.Many high power applications require multiple LEDs to achieve the neededpower levels, since individual LEDs are limited to a few watts. Inaddition, LEDs generate light in relatively narrow spectral bands.Hence, in applications requiring a light source of a particular color,the light from a number of LEDs with spectral emission in differentoptical bands is combined. Thus, the cost of many light sources based onLEDs is many times the cost of the individual LEDs.

The cost of an LED is increased by the need to package the LEDcontaining dies prior to installing those dies on printed circuit boardsand the like in the final product. The cost of conventional packagingthat relies on wire bonds to connect the dies to an underlying circuitcarrier represents a significant fraction of the cost of the final LED.Hence, “flip-chip” packages in which the LED die is modified such thatthe pads for powering the LED are on the opposite side of the die fromthe surface through which the light is emitted have been developed. Thepads are constructed such that the die can be soldered directly to apair of corresponding pads on a printed circuit board. Unfortunately,the techniques used to increase the conversion efficiency of LEDs arenot easily implemented in the flip-chip architecture.

The conversion efficiency of individual LEDs is an important factor inaddressing the cost of high power LED light sources. Electrical powerthat is not converted to light in the LED is converted to heat thatraises the temperature of the LED. Heat dissipation places a limit onthe power level at which an LED operates. In addition, the LEDs must bemounted on structures that provide heat dissipation, which, in turn,further increases the cost of the light sources. Hence, if theconversion efficiency of an LED can be increased, the maximum amount oflight that can be provided by a single LED can also be increased, andhence, reduce the number of LEDs needed for a given light source. Inaddition, the cost of operation of the LED is also inverselyproportional to the conversion efficiency. Hence, there has been a greatdeal of work directed to improving the conversion efficiency of LEDs.

The spectral band generated by an LED, in general, depends on thematerials from which the LED is made. LEDs commonly include an activelayer of semiconductor material sandwiched between additional layers.For the purposes of this discussion, an LED can be viewed as havingthree layers, the active layer sandwiched between two other layers.These layers are typically deposited on a substrate such as sapphire. Itshould be noted that each of these layers typically includes a number ofsub-layers.

Improvements in materials have led to improvements in the efficiency oflight generated in the active layer. However, a significant fraction ofthe light generated in the active layer is lost. Most of this light islost through absorption in the various layers used to construct the LED.This mode of light loss is aggravated by the trapping of much of thelight within the LED structure. Light that is generated in the activelayer must pass through the top layer or the substrate before exitingthe LED. Since the active layer emits light in all directions, the lightfrom the active region strikes the boundary between the outer layers ofthe LED at essentially all angles from 0 to 90 degrees relative to thenormal direction at the boundary. Light that strikes the boundary atangles that are greater than the critical angle is totally reflected atthe boundary. This light is redirected toward the other outer boundaryand is likewise reflected back into the LED. As a result, the light istrapped within the LED until it strikes the end of the LED or isabsorbed by the material in the LED. In the case of conventionalGaN-based LEDs on sapphire substrates approximately 70% of the lightemitted by the active layer is trapped between the sapphire substrateand the outer surface of the GaN.

Several techniques have been described to improve light extraction fromLEDs, and hence, improve the light conversion efficiency of thesedevices. In one class of techniques, one of the outer surfaces of theLED is converted from a smooth planar surface to a rough surface. Someof the light that is reflected at the other surface will return to therough surface at a location in which that light is now within thecritical angle, and hence, escape rather than being again reflected. Theremainder of the light is reflected back toward the smooth surface andreturns to the rough surface at a new location and at a range of angles,and hence. a portion of that light also escapes, and so on.

In a typical flip-chip LED, the light is emitted through the bottomsurface of the LED, i.e., through the substrate on which the LED layerswere deposited. Providing a rough surface at the substrate air boundaryis not as effective in reducing the trapping of light within the highindex GaN layers sandwiched between air and sapphire. Accordingly, therough surface is normally provided on the top surface of the LED, unlessit is applied to the bottom surface of the GaN by growing GaN on asurface-patterned sapphire substrate. However, in a flip-chip design,the top surface of the LED must also be a reflector. To convert therough surface to a reflector, a layer of metal such as silver is appliedto the surface. Unfortunately, the reflectivity of such a layer issubstantially less than 100 percent due to surface plasmon effectscaused by the underlying roughened layer.

To avoid this problem, prior art devices in which the substrate isremoved to expose the bottom layer of epitaxially grown GaN areutilized. The LED is first bonded to a new substrate, the sapphiresubstrate is removed and the bottom surface is then roughened. However,this technique has its own problems. First, the substrate removalprocess is not as well developed as the other types of processing usedto fabricate LEDs. Second, the process involves a number of additionalsteps that increase the cost of the LEDs. Finally, if during any periodof time the LED wafer is without a substrate, the wafer is extremelyfragile, and hence, subject to damage.

SUMMARY OF THE INVENTION

The present invention includes a light emitting device, a wafer formaking the same, and a method for fabricating the same. The device andwafer include a first layer including a material of a first conductivitytype, an active layer, and a layer including a material of a secondconductivity type. The active layer overlies the first layer, the activelayer generating light when holes and electrons recombine therein. Thesecond layer overlies the active layer, the second layer having a firstsurface in contact adjacent to the active layer and a second surfacehaving a surface that includes features that scatter light striking thesecond surface. A layer of transparent electrically conducing materialis adjacent to the second surface and covered by a first layer of adielectric material that is transparent to the light generated by theactive layer. A mirror layer that has a reflectivity greater than 90% isdeposited on the first layer of dielectric material. In one aspect ofthe invention, the mirror layer is connected to one of the first layerand the second layer by an electrically conducing via and a contactlayer overlies the mirror layer, the contact layer being connected tothe other of the first layer and the second layer by an electricallyconducting via. In another aspect of the invention, the mirror layer andcontact layer are connected to pads on the top surface of the devicethat are utilized for connecting the device to a printed circuit boardor the like.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is cross-sectional view of an LED according to one embodiment ofthe present invention.

FIG. 2 is a cross-sectional view of another embodiment of an LEDaccording to the present invention.

FIG. 3 is a cross-sectional view of another embodiment of an LEDaccording to the present invention.

FIG. 4 is a top view of a section of LED 40 through line 4-4 shown inFIG. 3.

FIGS. 5-10 are cross-sectional views of a portion of a wafer 80 atvarious stages in the fabrication of LEDs according to one embodiment ofthe present invention.

FIG. 11 illustrates the region of the wafer that would be divided intotwo dies as shown by dicing the wafer.

FIG. 12 illustrates wafer 200 according to one embodiment of the presentinvention.

FIG. 13 is a cross-sectional view of a portion of a wafer according toanother embodiment of the present invention.

FIG. 14 is a cross-sectional view of an LED according to anotherembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION

The manner in which the present invention provides its advantages can bemore easily understood with reference to FIG. 1, which iscross-sectional view of an LED according to one embodiment of thepresent invention. LED 20 is constructed on a sapphire substrate 21 byepitaxially growing a number of layers of GaN family materials. Tosimplify the following discussion, the layers may be grouped into threelayers. An n-type layer 22, an active layer 23, and a p-type layer 24.It is to be understood, however, that each of these layers may include anumber of sub-layers that vary in composition with respect to oneanother. In addition, it should be noted that the layers are not drawnto scale.

Active layer 23 generates light when holes and electrons from theadjacent layers combine therein. Active layer 23 can be constructed frommultiple InGaN layers separated by GaN layers. The precise details ofthe active region are known to the art, and hence, will not be discussedin detail here.

The upper surface of p-layer 24 is roughened by a suitable etchingprocedure after the layer has been deposited or by appropriate changesin the crystal growth conditions during the last part of the growth.Methods for roughening the p-layer are also known to the art, and hence,will not be discussed in detail here. Wafers having layers 22-24 onsubstrate 21 with layer 24 already roughened can be provided by varioussemiconductor foundries.

A transparent electrically conducting layer 25 is deposited on theroughened surface of p-layer 24. Indium tin oxide (ITO) can be used toconstruct layer 25. Layer 25 acts as a current spreading layer. Theresistance of p-layer 24 is too great to allow the current to be evenlydistributed over the active layer when a potential is applied to oneside of p-layer 24. Hence, layer 25 is introduced to provide anoptically transparent contact that covers the surface of p-layer 24.

Light striking the roughened surface of layer 24 is either scatteredback toward substrate 21 or transmitted by the surface. The light thatis transmitted by the surface is reflected back through layer 24 by amirror layer 27 that is encapsulated in a dielectric layer 26. Themirror layer can be constructed from silver or aluminum which have thehighest reflectance in the blue over the widest range of incidentangles. The dielectric encapsulant can be constructed from two layers ofspin-on glass (SOG) or other common dielectrics such as SiOx or SiNx.The first layer is deposited on the wafer and provides a smooth topsurface on which the silver is deposited. The smoothness of the surfaceon which the mirror is deposited is critical to the performance of themirror. If the surface is rough, the reflectivity of the mirror will besignificantly less than 90% in the blue (˜450 nm). SOG is chosen for thefirst layer because it provides a sufficiently smooth surface and isoptically transparent to the blue light generated in the active region.The mirror layer obtained with the SOG surface has a reflectivitygreater than 90%. It should be noted that the ITO layer is notsufficiently smooth to allow the mirror to be deposited on the ITO andhave the required reflectivity. If the mirror is deposited directly onthe ITO layer, the mirror will have a reflectivity less than 70 percent.If other dielectric layers are utilized, the layers must be planarizedto provide a reflectivity of greater than 90%. In this embodiment, themetal mirror layer is patterned such that the second layer of spin-onglass or other dielectric encapsulates the metal mirror.

After the encapsulated mirror is constructed, the wafer is etched toprovide vias that extend to layers 22 and 24. Metal electrodes 28 and 29are then deposited over these vias to provide the connection pads forpowering the LED. The top surfaces of electrodes 28 and 29 areapproximately coplanar, and hence, LED 20 can be mounted on a printedcircuit board by soldering the electrodes directly to corresponding padson the printed circuit board.

The encapsulation discussed above serves two functions. First, itprevents the material from which the mirror is constructed frommigrating. Metal migration is a significant problem if silver is usedfor the mirror material. Second, the encapsulant prevents the metalmirror layer from connecting electrodes 28 and 29, and hence, preventsthe shorting of these electrodes.

The above-described embodiments power the LED by applying the drivevoltages at the ends of the ITO and n-GaN layers. However, in large areadevices, the resistivity of the ITO and n-GaN layers becomes problematicat high currents. Hence, some additional form of current spreading isdesirable in large area LEDs. In some prior art devices, relativelythick or tall yet narrow metal fingers are deposited on the ITO and intrenches that expose the n-GaN layer to facilitate current spreading.Such electrode fingers are costly to make, mechanically fragile andsometimes damaged during die handling. In one embodiment of the presentinvention, the mirror layer is also used as a current spreading layer.Refer now to FIG. 2, which is a cross-sectional view of anotherembodiment of an LED according to the present invention. LED 30 issimilar to LED 20 discussed above in that a mirror layer 37 is formed onthe planar surface of a dielectric layer 38 that has been deposited overan ITO layer 35. Unlike LED 20, mirror layer 37 is connectedelectrically to electrode 39 and to ITO layer 35 at a plurality ofpoints over the surface of ITO layer 35. The connections between mirrorlayer 37 and ITO layer 35 are provided by a number of metal tilled vias41. Hence, mirror layer 37 acts as a current spreading electrode as wellas a mirror. The density of metal filled vias depends on the resistivityof the underlying ITO layer and the thickness of that layer. The spacingof the vias is chosen such that the voltage drop along the ITO layer isless than a predetermined value that depends on the degree of uniformityrequired for the particular LED design. In one embodiment of the presentinvention, the spacing between the vias is between 100 and 200 μm.

While the resistivity of the n-GaN material is significantly less thanthat of the p-type GaN material, current spreading problems also occurin the n-GaN layer if the device is sufficiently large. The currentspreading in the n-GaN layer can be improved by utilizing a secondmetallic layer that is connected to the n-GaN layer by a plurality ofmetal filled vias. Refer now to FIG. 3, which is a cross-sectional viewof another embodiment of an LED according to the present invention. LED40 includes a second current spreading layer that provides contacts tothe n-layer at a plurality of points. The current spreading layerincludes a metal layer 42 that overlies mirror layer 37. Metal layer 42is connected to an n-electrode 45. A plurality of insulated vias havinga metal core 44 and an insulating outer layer 43 connect layer 42 tovarious locations in n-layer 47 so that the distance from a potentialsource to any point in n-layer 41 is less than a predetermined distancethat depends on the design of LED 40.

Refer now to FIG. 4, which is a top view of a section of LED 40 throughline 4-4 shown in FIG. 3. For reference, FIG. 3 is the cross-sectionalview through line 3-3 shown in FIG. 4. The diameters of the metal filledvias are determined by the amount of current that must pass through eachvia, the length of the vias, and the resistivity of the metal used tofill the vias.

Refer now to FIGS. 5-10, which are cross-sectional views of a portion ofa wafer 80 at various stages in the fabrication of LEDs according to oneembodiment of the present invention. The process starts with a wafer inwhich the n-type layer 82, active region 83, and p-type layer 84 havealready been grown on a substrate 81 as shown in FIG. 5. The startingwafer also includes the roughened p-type surface and a layer of ITO 85.The vias for the n-type current spreading contacts are etched throughthe wafer as shown at 86. An insulating layer 87 is then deposited overthe wafer and the sides of via 86 and the glass at the bottom of thevias is removed by etching. Finally, a metal layer 88 is deposited invia 86. Insulating layer 87 can be constructed from spin on glass (SOG)or any other suitable insulator. In this embodiment, metal layer 88 isCr/Au; however, other conductors such as Ti/Au, Cr/Pt/Au can beutilized.

Refer now to FIG. 6. After the n-vias have been filled, a mirror layer92 is deposited over the surface of insulating layer 87. Mirror layer 92is patterned to leave openings 91 therein for the p-type vias that willprovide the p-type current spreading contacts to ITO layer 85. In thisembodiment, mirror layer 92 is constructed from an Ag/Ti alloy toimprove the bonding of the mirror layer to Cr/Au layer 88.

Refer now to FIG. 7. After the mirror layer has been deposited andpatterned, an insulating layer 94 is deposited over the mirror layer.Vias such as via 93 are then opened in insulating layers 94 and 87 toexpose the underlying ITO layer 85. Next, a second metal layer 95 isdeposited over insulating layer 94 as shown in FIG. 8. The metal fillsvia 93 provide a contact to ITO layer 85.

Refer now to FIG. 8. Metal layer 95 is patterned to include an opening96 that will be used to provide an insulated metal filled via that willconnect metal layer 92 to a contact on the top surface of the finalwafer. Next, an insulating layer 97 is deposited over metal layer 95 andvias 98 and 99 are opened to provide access to metal layers 92 and 95,respectively, as shown in FIG. 9. Finally, a metal layer is depositedover insulating layer 97 and patterned to provide electrodes 101 and 102as shown in FIG. 10. Electrode 101 provides an external contact forpowering the n-layer, and electrode 102 provides an external contact forpowering the p-layer.

The above-described figures provided a cross-sectional view of a portionof a wafer that corresponded to part of a single die. To further clarifythe wafer level structures, refer to FIGS. 11 and 12, which arecross-sectional views of a portion of a wafer that includes two diesafter the steps discussed above with respect to FIGS. 5-10 have beencompleted. The portion of wafer 200 shown in FIG. 11 comprises theregion of the wafer that would be divided into the two dies shown at 220and 230 by dicing the wafer through lines 210-212. The various layers inthe wafer are continuous across the wafer with the exception of thevarious vias discussed above and the top contacts. The top metal layerthat connects to p-contact points is shown at 207, and the mirror layerthat also provides the connections to the n-contact points is shown at206. To simplify the drawing, the roughened surface between p-layer 204and ITO layer 205 has been omitted. The active layer is shown at 203,and the n-layer is shown at 202.

Refer now to FIG. 12. Prior to dicing wafer 200, trenches are cut at thedice points as shown at 241-243. Each trench extends from the topsurface of wafer 200 to a point below the active layer. An insulatingmaterial is deposited on the walls of the trenches as shown at 245. Theinsulating material is SiOx or SiNx in one embodiment of the presentinvention. The insulating layer seals the edge of the die to protect theactive layer and p-layers from moisture so that the die can be directlybonded to a printed circuit board without further packaging. Pads 221and 222 provide the flip-chip bond pads for die 220, and pads 231 and232 provide the flip-chip bond pads for die 230.

It should be noted that the same wafer could be diced into larger diesby omitting one of the dicing points discussed above. For example,consider the case in which trench 242 is omitted and pads 222 and 231are removed by using a different mask at that step. When the water isdiced through trenches 241 and 243. a die having twice the width will beformed from the portion of the wafer that was originally diced toprovide dies 220 and 230. The n-contact for this new die will be pad 221and the p-contact for the new die will be pad 232. Hence, the same wafercan be used to make dies of a variety of sizes by altering the masksused in the trenching operation. Accordingly, a manufacturer need onlystock one wafer, and hence, the time needed to change die sizes issubstantially reduced.

Heat dissipation is a significant problem in high-powered LEDs. In oneclass of LED, the heat generated in the LEDs is transferred to the coreof the printed circuit board to which the LEDs are attached. The heat istransferred either through pads that are connected to one of the powerterminals of the LED or to pads that are in contact with the LED butinsulated from the power terminals. The area of the pad that isconnected to the core must be sufficient to assure that the thermalresistance through the pad is not the limiting factor in moving heatfrom the LED to the core of the printed circuit board. In one embodimentof the present invention, a third pad is added to the top surface of thedies to provide heat transfer to a corresponding pad on the printedcircuit board. Refer now to FIG. 13, which is a cross-sectional view ofa portion of a wafer 250 that is similar to wafer 200 discussed above.The dies on wafer 250 include pads 251 that provide an insulated contactthat can be used for transferring heat to a printed circuit board. Ifthe heat conduction pad is to be one of the electrical power padsinstead of an electrically isolated pad, that pad can be increased insize accordingly.

The above-described embodiments of the present invention utilize an LEDconfiguration in which the n-type layer is deposited on the substrateand the p-type layer is deposited last. However, configurations in whichthe p-type layer is deposited on the substrate and the n-type layer isdeposited last could also be constructed.

The above-described embodiments utilize the GaN family of materials. Forthe purposes of this discussion, the GaN family of materials is definedto be all alloy compositions of GaN, InN and AlN. However, it should benoted that the present invention could be practiced with other materialsystems.

The above-described embodiments utilize a metal layer as the mirror.However, embodiments that utilize other forms of mirror can also beconstructed. Refer now to FIG. 14, which illustrates an LED according toanother embodiment of the present invention. LED 300 is similar to LED20 discussed above with reference to FIG. 1, and hence, structures thatperform functions analogous to those described above have been given thesame numeric designations and will not be discussed in detail here. LED300 differs from LED 20 in that the mirror layer has been replaced by astack of dielectric layers 301 with alternating indices of refraction.The thickness of the layers and materials are chosen such that light ofthe wavelength generated in active layer 23 is constructively reflectedfrom the boundaries of the various layers to form a mirror that isanalogous to the mirrors used in VCSELs, such as distributed Braggreflectors. A metallic layer 302 can optionally be included to furtherincrease the reflectivity of the mirror for light that strikes stack 301at angles that are significantly off axis. The metal layer can beencapsulated between the dielectric layers of stack 301 and a dielectriclayer 303 to prevent electrodes 28 and 29 from being shorted.

The above-described embodiments of the present invention utilize layersthat overlie another layer. For the purpose of this application, it isto be understood that a first layer that overlies a second layer may ormay not be in direct contact with the second layer. Similarly, theabove-described embodiments utilize layers of transparent material. Forthe purposes of this application, a layer will be defined as beingtransparent if the layer transmits light of the wavelength generated inthe active layer with a transmittance of greater than 90%. A mirrorlayer is defined to be a layer that reflects light of the wavelengthgenerated by the active layer with a reflectance of greater than 90%.

The above-described embodiments include a substrate on which the variouslayers are deposited during the fabrication of the devices. However, thesubstrate can be removed from the completed parts by bonding the waferhaving the completed parts to a carrier and then removing the substrateby exposing the GaN-sapphire boundary to light of the appropriatewavelength. Removing the substrate provides advantages in someembodiments.

Various modifications to the present invention will become apparent tothose skilled in the art from the foregoing description and accompanyingdrawings. Accordingly, the present invention is to be limited solely bythe scope of the following claims.

1. A device comprising: a first layer comprising a material of a firstconductivity type; an active layer overlying said first layer, saidactive layer generating light when holes and electrons recombinetherein; a second layer comprising a material of a second conductivitytype, said second layer having a first surface overlying said activelayer and a second surface opposite to said first surface comprisingfeatures that scatter light striking said second surface; a layer oftransparent electrically conducing material overlying said secondsurface, said layer of transparent electrically conducting materialhaving a rough surface that is not in contact with said second layer; afirst layer of a dielectric material that is transparent to said lightgenerated by said active layer, said first layer having a first surfacein contact with said rough surface and a second surface; and areflective layer deposited on said second surface of said firstdielectric layer, wherein said reflective layer has a reflectivitygreater than 90%, and wherein said reflective layer would have areflectivity less than 70% if deposited directly on said rough surface.2. The device of claim 1 further comprising a second layer of adielectric material overlying said reflective layer, said reflectivelayer being encapsulated by said first and second layers of dielectricmaterial.
 3. The device of claim 1 wherein said first layer ofdielectric comprises spin-on-glass.
 4. The device of claim 1 whereinsaid reflective layer comprises silver.
 5. The device of claim 1 whereinsaid transparent electrically conducting material comprises indium tinoxide.
 6. The device of claim 1 wherein said first layer, said secondlayer, and said active layer comprise materials from the GaN family ofmaterials.
 7. The device of claim 1 wherein said reflective layer isconnected to one of said first layer and said second layer by anelectrically conducing via.
 8. The device of claim 7 further comprisinga contact, layer overlying said reflective layer, said contact layerbeing connected to the other of said first layer and said second layerby an electrically conducting via.
 9. The device of claim 8 wherein saidelectrically conducting via connecting said contact layer to the otherof said first and second layers passes through an opening in saidreflective layer.
 10. The device of claim 8 wherein said devicecomprises a top surface and a bottom surface, light generated in saidactive layer being emitted from said bottom surface, and wherein saidtop surface includes a first electrically conducting structureelectrically connected to said reflective layer.
 11. The device of claim10 wherein said top surface includes a second electrically conductingstructure that is electrically connected to said contact layer.
 12. Thedevice of claim 10 wherein said reflective layer and said contact layerare separated by a second layer of dielectric.
 13. The device of claim12 wherein said contact layer underlies a third layer of dielectrichaving a surface comprising said top surface.
 14. The device of claim 11wherein said first and second electrically conducting structures haveouter surfaces that are coplanar and are adapted to being soldered to anexternal device.
 15. The device of claim 11 further comprising a heatconducting structure on said top surface, said heat-conducting structurehaving an outer surface that is coplanar with said first and secondelectrically conducting structures.
 16. A method of fabricating a lightemitting device comprising: providing a wafer having a top and bottomsurface, said wafer comprising a first layer comprising a material of afirst conductivity type; an active layer overlying said first layer,said active layer generating light when holes and electrons recombinetherein; a second layer comprising a material of a second conductivitytype overlying said active layer, said second layer having a firstsurface in contact adjacent to said active layer and a second surfacehaving a surface comprising features that scatter light striking saidsecond surface; a layer of transparent electrically Conducing materialoverlying said second surface, said layer of transparent electricallyconducting material having a rough surface that is not in contact withsaid second layer; a first layer of a dielectric material that istransparent to said light generated by said active layer, said firstlayer having a first surface in contact with said rough surface and asecond surface; and a reflective layer deposited on said second surfaceof said first dielectric layer, wherein said reflective layer has areflectivity greater than 90%, and wherein said reflective layer wouldhave a reflectivity less than 70% if deposited directly on said roughsurface. a plurality of first electrically conducting structures on saidtop surface, each first electrically conducting structure beingconnected electrically to said first layer; and a plurality of secondelectrically conducting structures on said top surface spaced apart fromsaid first electrically conducting structures and connected electricallyto said second layer; and dicing said wafer at points between said firstand second electrically connecting structures to provide light emittingdevices having one of said first electrically conducing structures andone of said second electrically conducting structures, said lightemitting devices emitting light when a potential difference is appliedbetween said first and second electrically conducting structures on saidlight emitting device.
 17. The method of claim 16 wherein providing saidwafer comprises: depositing said first layer, said active layer, andsaid second layer on a substrate; processing said second layer toprovide said features; depositing said layer of transparent electricallyconducting material over said features; depositing said first layer ofdielectric; and depositing said reflective layer on a surface of saidfirst layer of dielectric.
 18. The method of claim 16 wherein saiddicing of said wafer further comprises removing one of said first andsecond electrically conducting structures from one of said electricallyconducting devices.
 19. A device comprising: a semiconductor lightemitter having a first source surface, said semiconductor light emittergenerating light of a wavelength that passes through said first sourcesurface, said first source surface having features that scatter light ofsaid wavelength; a transparent dielectric layer overlying said firstsource surface, said transparent dielectric layer having first andsecond dielectric surfaces, said first dielectric surface being incontact with said first source surface; and a reflective layer depositedon said second surface of said transparent dielectric layer, whereinsaid reflective layer has a reflectivity greater than 90%, and whereinsaid reflective layer would have a reflectivity less than 70% ifdeposited directly on said first source surface.
 20. The device of claim19 wherein said reflective layer comprises a distributed Braggreflector.